Cooperation, integration and certification
Since the beginning of FEKO development, our engineers have relied on the support of hardware and software partners. We thankfully acknowledge support from the following companies.
Interfaces and cooperations with other solutions |
||
|---|---|---|
| Company |
Product |
Description |
| Antenna Magus |
Antenna Magus | Antenna Magus exports antenna models for further analysis in FEKO. |
| Altair |
HyperWorks Enabled Partner Program | FEKO provides EM solution component to Altair's
HyperWorks Enabled Partner Program. (
News Announcement...) |
| CrunchSpace S.A. |
CrunchYard | CrunchYard offers FEKO customers the ability to run their simulations remotely on a large parallel simulation platform. ( News Announcement...) |
| ESI Group |
CRIPTE | Interface with CRIPTE
for analysis of complex cable harness coupling (EMC/EMI
analysis). |
| SimLab |
CableMod; PCBMod | Interface with CableMod/PCBMod for the solution of advanced EMC/EMI problems. |
| TICRA |
GRASP (Data Format) |
FEKO can export far-field data in a GRASP compatible format.
This allows feeds, analysed by FEKO, to be easily used as feeds for the
reflector antenna analysis code GRASP. |
| Schmid & Partner Engineering AG | SEMCAD |
FEKO can export 3D near-field data to the SEMCAD format. This
allows SEMCAD users to model large, complex environments with FEKO and
then to use local fields as excitation in SEMCAD. |
Hardware, software and related |
||
| Company |
Product |
Description |
| Intel |
Intel Software Partner Program |
|
| HP |
HP Developer & Solution Partner Program (DSPP). |
|
| IBM |
Member of IBM PartnerWorld programme. |
|
| Microsoft |
Microsoft Partner Programme (Certified Member). |
|
| SUN |
Member of the SDC (SUN Developer Connection). |
|
| SGI |
Member of the SGI Solution Network Program (Preferred Member
status). |
|
| Siemens PLM Software | Parasolid | FEKO's geometry modeller is based on Parasolid, the world’s leading production-proven 3D geometric modeling component software, providing core functionality that enables users of Parasolid-based products to rapidly and robustly model the industry’s most complex products. |
| Techsoft3D | HOOPS | HOOPS is a 2D/3D development platform for creating or enhancing professional-grade applications. |
Certification |
||
| Company |
Standard |
Description |
| Intel |
Intel Cluster Ready | FEKO works closely with Intel to achieve the best possible performance from cluster computing environments. In this endeavour, Intel certified (Suite 5.3, Sept. 2007 and Suite 5.5, Sept. 2009) FEKO as "Intel Cluster Ready". |
| RedHat |
RedHat Ready |
As part of a German Automotive Company initiative, FEKO has been certified as "RedHat Ready". |
| Microsoft |
(ISV)/Software Solution Competency Program |
|
| Microsoft |
Compatible with Windows 7 |
FEKO 5.5 has been tested against Microsoft standards and has been
certified as compatible with Windows 7 on both 32-bit and 64-bit
platforms. |
| Lionbridge |
Veritest |
The Windows installation of FEKO Suite 5.5 is certified by Veritest
(partner of Microsoft) for both client (Windows XP) and server (Windows
HPC) environments. |
Preferred Providers of Intel Cluster Ready Hardware
North America
- Atipa Technologies (http://www.atipa.com/)
- Aspen Systems (http://www.aspsys.com/)
Europe
- Transtec (http://www.transtec.co.uk/)

