Partnerships
| Intel |
Intel Software Partner Program |
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| Intel |
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| HP |
HP Developer & Solution Partner Program (DSPP). |
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| IBM |
Member of IBM PartnerWorld programme. |
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| Microsoft |
Microsoft Partner Programme (Certified Member). |
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| SUN |
Member of the SDC (SUN Developer Connection). |
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| SGI |
Member of the SGI Global Developer Program (Developer Plus level). |
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| Siemens PLM Software | Parasolid |
FEKO's geometry modeller is based on Parasolid, the world’s leading production-proven 3D geometric modeling component software, providing core functionality that enables users of Parasolid-based products to rapidly and robustly model the industry’s most complex products. |
| Techsoft3D | HOOPS |
FEKO incorporates HOOPS, which is a 2D/3D development platform for creating or enhancing professional-grade applications. |
